NXP i.MX 8

Familie

Die funktions- und leistungsskalierbaren Multicore-Plattformen der i.MX 8-Familie mit Single-, Dual- und Quad-Core Prozessoren basieren auf der Arm Cortex-Architektur (Cortex-A72, Cortex-A53, Cortex-A35, Cortex-M4 und Cortex-M7) und bieten Ihnen rechenstarke Lösungen für:

  • Grafik, Imaging und Machine Vision
  • Sicherheitskritische Anwendungen
  • Audio-, Video-, KI-Anwendungen

Prozessor-Blockschaltbilder:

  phyCORE-i.MX 8M Plus phyCORE-i.MX 8M Mini phyCORE-i.MX 8M Nano phyCORE-i.MX 8M phyCORE-i.MX 8 phyCORE-i.MX 8X
Besonderheiten Neural Processing Unit (NPU), Image Signal Processor (ISP) Low-Cost, VPU Low-Cost 4kp60 HEVC/H.265 und HDMI 2 GPUs, HDMI, SATA 1 GPU, NAND Flash
Anwendungen     PDF herunterladen      
Zugehöriges Development Kit phyBOARD-Pollux Development KitphyBOARD-Polis Development KitphyBOARD-Polis Development KitphyBOARD-Polaris Development Kit Auf Anfrage phyCORE-i.MX 8X Alpha Kit
CPU Quad/QuadLite:
4x Cortex-A53 (1.8 GHz) Dual:
2x Cortex-A53 (1.8 GHz)
Quad/QuadLite:
4x Cortex-A53 (1.8 GHz)
Dual/DualLite:
2x Cortex-A53 (1.8 GHz)
Solo/SoloLite:
1x Cortex-A53 (1.8 GHz)
Quad/QuadLite:
4x Cortex-A53 (1.5 GHz) Dual/DualLite:
2x Cortex-A53 (1.5 GHz) Solo/SoloLite:
1x Cortex-A53 (1.5 GHz)
Quad:
4x Cortex-A53 (1.5 GHz) Dual:
2x Cortex A53 (1.5 GHz) QuadLite:
4x Cortex-A53 (1.5 GHz)
QuadMax:
2x Cortex-A72 (1.6 GHz) 4x Cortex-A53 (1.2 GHz) QuadPlus:
1x Cortex-A72 (1.6 GHz) 4x Cortex-A53 (1.2 GHz)
QuadXPlus:
4x Cortex-A35 (1.2 GHz) DualXPlus:
2x Cortex-A35 (1.2 GHz) DualX:
2x Cortex-A35 (1.2 GHz)
Architecture ARM Cortex-A53 / Cortex-M7 ARM Cortex-A53 / Cortex-M4 ARM Cortex-A53 / Cortex-M7 ARM Cortex-A53 / Cortex-M4 ARM Cortex-A53 / Cortex-A72 / Cortex-M4F ARM Cortex-A35 / Cortex-M4F
Instruction Set  64 bit 64 bit 64 bit 64 bit 64 bit 64 bit
Frequency up to 1.8 GHz up to 1.8 GHz up to 1.5 GHz up to 1.5 GHz up to 1.6 GHz up to 1.2 GHz
Performance max. 16,560 DMIPS 3450 to 16,560 DMIPS 3450 to 13,800 DMIPS 3450 to 13,800 DMIPS 5860 to 28,650 DMIPS 5040 to 7240 DMIPS
DSP Tensilica HiFi 4
800 MHz
- - - Tensilica HiFi 4
666 MHz
Tensilica HiFi 4
666 MHz
Neural Network Accelerator 2,3 TOPS - - - - -
GPU GC7000UL (2 shaders) 166 million triangles/s 1.0 giga pixel/s
16 GFLOPs 32-bit
GC NanoUltra 3D (1 shader ) + GC30 2D (6,4 GFLOPs) GC7000UltraLite (2 shaders) GC7000Light (4 shader) (25,6 GFLOPs) 2 x GC7000XS/VX (8 shader) (128 GFLOPS)  GC7000Light (4 Shader) (25,6 GFLOPs)
OpenGL/VG/CL OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL1.2 OpenGL/ES 1.1, 2.0, OpenVG 1,1, Vulkan OpenGL ES 3.1, Vulkan, OpenCL 1.2 OpenGL/ES 1.1, 2.0, 3.0, 3.1, OpenCL1.1/1.2FP, Vulkan OpenGL/ES3.2, 3.1, 3.0 (2.x, 1.x), OpenVX 1.01, OpenCL2.0 16 Vec4 shaders with 64 execution units (Split GPU for dual independent 8-Vec4 shader GPUs possible), OpenVG1.1, Vulkan OpenGL/ES 1.1, 2.0, 3.0, 3.1 OpenCL 1.2 FP, Vulkan
ISP (Image Signal Processor) 2x ISP up to 12 MP resolution - - - - -
VPU Decode: 1080p60 video decoding (H.265, H.264, VP9, VP8)
Encode: 1080p60 video (H.265, H.264)
Decode: 1080p60 VP9 decoder,1080p60 HEVC/H.265, 1080p60 AVC/H.264, 1080p60 VP8,
Encode: 1080p60 AVC/H.264 encoder, 1080p60 VP8 encoder
- Decode: 4kp60 HEVC/H.265, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVC, MJPEG, H.263  Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264  Decode: 4kp30 H.265, 1080p60 H.264,1080p30 H.264 
HW Security Secure boot, TrustZone, SNVS, SRTC, SJC HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG HAB secure boot, TrustZone, True RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 256, ECC, secure JTAG HAB secure boot, Arm TrustZone®, RNG, RSA up to 4096, AES- 128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 4x tamper pins HAB secure boot, TrustZone, RNG, RSA up to 4096, AES-128/192/256, 3DES, ARC4, MD-5, SHA up to 512, flashless SHE, ECC, secure JTAG, 10x tamper pins
HW Crypto RDC, CAAM, PKHA, RSA, EEC, RTIC, DRM, RSA, AES, 3DES, DES, RNG AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG AES, RSA, SHA-256, 3DES, DES, ECC, ARC4, MD5, TRNG AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG AES, 3DES, RSA, ECC Ciphers, SHA1/256, TRNG
  phyCORE-i.MX 8M Plus phyCORE-i.MX 8M Mini phyCORE-i.MX 8M Nano phyCORE-i.MX 8M phyCORE-i.MX 8 phyCORE-i.MX 8X
NAND Flash - - - - - 128 MB to 1 GB (optional with eMMC)
SPI NOR Flash 4 MB - 256 MB Quad SPI Flash 8 MB - 256 MB  Quad SPI Flash 8 MB - 256 MB  Quad SPI Flash 8 MB - 256 MB  Quad Spi Flash 64 MB - 256 MB Octal SPI/Dual SPI Flash64 MB - 256 MB Octal SPI/Dual SPI Flash
eMMC 4 GB - 64 GB eMMC 5.1 4 GB - 128 GB 4 GB - 128 GB 4 GB - 128 GB 4 GB - 128 GB 4 GB - 128 GB (optional with NAND Flash)
LPDDR4 RAM 512 MB - 4 GB (32 Bit) x16 or x32 LPDDR4/ Inline ECC 512 MB - 4 GB (32 Bit) 256 MB - 2 GB (16 Bit) 512 MB - 4 GB (32 Bit) 1 GB - 8 GB  (64 Bit) 512 MB - 4 GB  (32 Bit)
EEPROM 4 kB - 32 kB 4 kB 4 kB 4 kB 4 KB 4 kB
  phyCORE-i.MX 8M Plus phyCORE-i.MX 8M Mini phyCORE-i.MX 8M Nano phyCORE-i.MX 8M phyCORE-i.MX 8 phyCORE-i.MX 8X
Ethernet 2x 10/100/1000 Mbit/s (1x TSN) 1x 10/100/1000 Mbit/s  1x 10/100/1000 Mbit/s  1x 10/100/1000 Mbit/s  2x 10/100/1000 Mbit/s (1x onboard / 1x RGMII)2x 10/100/1000 Mbit/s (1x onboard / 1x RGMII)
USB 2x USB 3.0 Type C with PHY 2x USB 2.0 OTG 1x USB 2.0 OTG 2x USB 3.0 1x OTG, 1x USB 3.0 1x OTG, 1x USB3.0
UART 4x 4x 4x 4x 2x 2x
CAN 2x (1x CAN FD) via SPI to CAN-FD Converter possible via SPI to CAN-FD Converter possible via SPI to CAN-FD Converter possible 2x3x
PCI / PCIe 1x PCIe Gen 3 1x - 1x 2x 1x
I²C 3x 3x 3x 4x- up to 19x up to 10x
SPI 3x ECSPI 2x 2x OSPI 2x SPI up to 4x + 1x QSPI 1x OCTAL SPI or 2x Quad SPI + 3 SPI
MMC/SD/SDIO 3x SDIO (1 used for eMMC) 2x 2x 1x SDIO 2x 1x (only with eMMC available)
Keypad - - - - 1x yes
PWM 4x PWM, 6x Timer up to 4x 4x 4x yes yes
A/D via I²C AD Converter via I²C AD Converter via I²C AD Converter  via I²C AD Converter 8x 6x
SATA - - - - 1x -
Display LVDS (4/8-lanes),
MIPI DSI (4-lanes),
HDMI 2.0a Tx
LVDS or DSI-2 
(1x 1080p60)
LVDS or DSI-2 
(1x 1080p60)
MIPI DSI,
HDMI (1x 4Kp60 HDR and 1x 1080p60)
2x LVDS, 2x MIPI DSI,
1x HDMI
 (1x UltraHD 4Kp60 display or up to 4x independent FullHD 1080p60 displays)
2x LVDS or 2x MIPI DSI, 1x Parallel (2x 1080p, 1x WVGA )
Audio 18x I²S TDM (32 b @ 384 KHz), ASRC, 8-ch. PDM DMIC input, eARC 4x SAI 4x SAI 5x SAI 2x SAI up to 4 SAI 4x SAI
Camera 2x MIPI CSI (4 lanes each) 1x MIPI CSI-2 1x MIPI CSI-2 2x MIPI CSI 2x MIPI CSI, 1x HDMI in 1x MIPI CSI, 1x parallel
  phyCORE-i.MX 8M Plus phyCORE-i.MX 8M Mini phyCORE-i.MX 8M Nano phyCORE-i.MX 8M phyCORE-i.MX 8 phyCORE-i.MX 8X
RTC Low power, high precision external RTC Low power, high precision external RTC Low power, high precision external RTC i.MX 8 internal i.MX 8 internal i.MX 8 internal
Power Supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Dimensions 40 mm x 37 mm40 mm x 37 mm40 mm x 37 mm 55 mm x 40 mm 73 mm x 45 mm 52 mm x 42 mm
Connectors Samtec (2x 120 pins + 1x 60 pins) or Fused Tin Grid Array (FTGA) 319 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) 319 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) 501 solder pads, 1.27 mm pitch Fused Tin Grid Array (FTGA) Samtec 0.5 mm pitch (480 pins) Samtec 0.5 mm pitch (280 pins)
Temperature range -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to+85°C -40°C to+85°C -40°C to +85°C

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