RECOMMENDED FOR DESIGNS

phyCORE®-i.MX 8M
ARM Cortex ™ -A53 / -M4F

Particularly suitable for multimedia, operating units and networked applications.

  • Quad Core Cortex-A53 1,5 GHz and Cortex-M4F
  • Wi-Fi / BLE 4.2 onboard
  • 4k Ultra HD, HDR10, Dolby Vision
  • Optimal signal and system stability
  • Fused Tin Grid Array (FTGA) with excellent shock and vibration resistance
  • Maximum 8 GB LPDDR4 RAM, up to 64 GB eMMC
  • 505 pins, large interface subset 
  • Suitable for applications in demanding and harsh environments
  • Optimized pinout for carrier boards with low circuit complexity

60 mm x 40 mm

ARM Cortex-A53 / -M4F

NXP i.MX 8M processor with up to 1,5 GHz and 3D graphics acceleration
  • Quad Core Cortex-A53 1,5 GHz and Cortex-M4F 400 MHz
  • GC7000L 3D graphics processor
  • 4k Ultra HD, HDR10, Dolby Vision
On-board
  • Maximum 8 GB LPDDR4 RAM, up to 64 GB eMMC
  • 4 kB EEPROM and up to 64 MB QSPI NOR flash
  • Module PMIC, GBit Ethernet-PHY, RTC, Wi-Fi / BLE 4.2
Small, compact dimensions
  • Dimensions: 60mm x 40mm x 5mm
  • 501 solder contacts + 4 solder corners
  • Fused Tin Grid Array (FTGA) with excellent vibration resistance
Development advantages
  • 3,3 V power supply and optimized pinout for carrier boards with low circuit complexity
  • Soldering module, therefore direct cost savings by saving the connectors
  • Optimal EMC properties thanks to more than 20% GND contacts that are directly assigned to the individual signals
Processor i.MX 8MDual / i.MX 8MQuadLite / i.MX 8MQuad
Architecture ARM Cortex-A53 / Cortex-M4F
bit width Architecture 64-bit, RAM bus connection 32-bit
Frequency up to 4x 1.5 GHz
Graphics 3D GPU (Vivante GC7000 Lite)
Video 4k Ultra HD, HDR10, Dolby Vision
Security AES, 3DES, RSA, ECC Ciphers, SHA1 / 256, TRNG
SPI NOR Flash 4MB - 64MB
eMMC 4GB - 64GB
LPDDR4 RAM 512MB - 8GB
EEPROM 4 kB
Ethernet 1x 10/100/1000 Mbit / s, RGMII optional
WiFi 802.11 b / g / n (ac) 2.4 GHz / 5 GHz
Bluetooth BLE 4.2
USB 2x USB 3.0 OTG
UART 4x
PCle 2x PCIe 2.0
I²C 3x
SPI up to 3x ECSPI, 2x QSPI
MMC / SD / SDIO 1x SDIO
PWM 4x
Display 1x MIPI DSI, 1x HDMI
Audio up to 6x SAI, 1x SPDIF
Bedroom 2x MIPI CSI-2
RTC Low-power, high-precision external RTC
Power supply 3.3 V
Connectors 501 solder pads, 1.27 mm pitch, Fused Tin Grid Array (FTGA)
Dimensions 60 40 mm x mm
temperature range 0 ° C to + 70 ° C, -40 ° C to + 85 ° C
Operating system Linux 4.14.98 /emteria OS v9.0.0
Distribution Yocto 2.5.3 (Sumo) / Android 9.0

phyCORE-i.MX 8M

Yocto-Linux FSL kernel
Release name Release version Release Notes BSP Manual Yocto Manual Development Env. Guide Miscellaneous

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